BGA chip test socket

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Can be used for feature verification, feature debugging and manual production testing in the R & D lab

Classification:

Quantum Assemblies

Key words:

frequency

socket

Telephone:

+86-029-68903703

Consulting

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Product Description

AVIC Fujita can provide various types of IC test sockets to test the finished chip after packaging. The socket adopts an integrated PIN pin structure and is suitable for various packages. It can be used for characteristic verification, characteristic debugging and manual mass production testing in research and development laboratories.

Product Introduction

The newly developed BGA chip test socket contains 2 low frequency ports and 10 radio frequency ports, mainly including transfer layer, regulating pressure plate, probe and other components. By adjusting the pressure plate can be compatible to test different thickness of the chip.

Product characteristics

RF Port

• Characteristic impedance: 50Ω;

• Frequency range: DC ~ 40GHz;

Voltage standing wave ratio: ≤ 1.4;

• Minimum test spacing: 0.4mm;

• Fit chip package form: BGA;

• Compatible chip thickness: 3.6mm ~ 5.0mm.

Product Advantages

• Integration

• Modularity

• Miniaturization