HTCC
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  • HTCC

HTCC

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Wiring and hole filling with screen printed metal paste

Classification:

Key words:

slurry

through

screen

Product Description

HTCC, also known as high temperature co-fired multilayer ceramic substrate. In the preparation process, ceramic powder (Al2O3 or AlN) is first added with organic binder, mixed evenly and then becomes paste-like slurry, then the slurry is scraped into sheets by a scraper, and then the sheet-like slurry is formed into green bodies through a drying process. Then, through holes are drilled according to the design of each layer, wiring and hole filling are carried out by screen printing metal paste, and then the green layers are superimposed and sintered in a high temperature furnace (1600 ℃).

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